Gold Re-plating Service
Gold plating is often used from DRAM memory module edge connectors, to electrical test probe contacts, to power semiconductor die metallization and wire bonding pads. With direct gold-on-copper plating, the copper atoms have the tendency to diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide/sulfide layer. Therefore, a layer of a suitable barrier metal, usually nickel, has to be deposited on the copper substrate, forming a copper-nickel-gold sandwich.
General Properties of Our 24K Gold Plating Solution
We provide Gold Re-plating service on Test Sockets, Contact Fingers, Contact Pins, Pogo Pins, Probe Pins, etc.